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Description
Amphenol Sine Systems’ Armor IPX™ Family of Sealed Enclosures provides superior protection for printed circuit boards and electronic control modules in harsh environments and off-road applications. Available in two (2) sizes, as well as three (3) different material types: Clear or Black Thermoplastic, or Ultem® (Transparent Amber).
Features & Benefits
Available in Standard and Large sizes
Available in Ultem® (Amber), Thermoplastic (Black) or Polycarbonate (Clear)
Intermatable with industry standard connectors
Optional header configurations: AT Series™ 12, 24, 36, 48 I/O (A, B, C & D Keying) and ATM Series™ 12, 24 I/O (A, B, C & D Keying)
Rugged tandem through-hole design for ease of mounting
Snap-in headers establish ease of interface with PCB
Cross-hatch design increases venting protection
Enclosures are resistant to most external fluids used in industrial applications
Custom/Blank Headers - available to assist in establishing additional connector interface flexibility.
Vented Enclosures - allow for atmospheric pressure differentials (+ or -), due to heat (sun load, board heat, etc.), which help alleviate seal leakage under extreme conditions. For environments requiring ‘clean’ venting, customers often purchase venting patches which keep out oils and moisture. (The circular flat area inside the enclosure is made to accommodate these patches.)
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Product Category
Board-Level Connectors
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