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Description
Amphenol’s RADSOK® SMT RADSERT™ provides a high-current, low-profile interconnect solution for board-to-board mezzanine applications. Featuring the RADSOK® technology, it delivers up to 200A with options for SMT, press-fit, or wave solder terminations. Ideal for high-power PCB applications, it supports multiple mating positions and offers robust performance with minimal space requirements.
Features & Benefits
The SMT RADSERT™ is preferred for PCB applications for efficient current transmission and ease of application
High power to board interconnect in a small package
Perfect for mezzanine applications
RADSOK® R4 hyperbolic socket design ensures many points of contact
The SMT RADSERT™ is compatible with standard surface mount board fabrication processes
RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A), 5.7mm (120A) & 8.0mm (200A)
No special crimp tools required
No threaded fasteners
Faster through-put
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Product Category
Board-Level Connectors
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