Do you need a custom solution for this product?
Connector Design | Cable Assembly Design | Box Builds | PCB Design | More
Connect with an Expert
Description
Amphenol’s RADSOK® SMT RADSERT™ provides a high-current, low-profile interconnect solution for board-to-board mezzanine applications. Featuring the RADSOK® technology, it delivers up to 200A with options for SMT, press-fit, or wave solder terminations. Ideal for high-power PCB applications, it supports multiple mating positions and offers robust performance with minimal space requirements.
Features & Benefits
The SMT RADSERT™ is preferred for PCB applications for efficient current transmission and ease of application
High power to board interconnect in a small package
Perfect for mezzanine applications
RADSOK® R4 hyperbolic socket design ensures many points of contact
The SMT RADSERT™ is compatible with standard surface mount board fabrication processes
RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A), 5.7mm (120A) & 8.0mm (200A)
No special crimp tools required
No threaded fasteners
Faster through-put
Visit Product Site
Product Category
Board-Level Connectors
Additional Products from this industry
Connect with Our Team
Our Solution Experts are your trusted partners in connection, driving innovative solutions, building strong relationships, and empowering your success through unmatched expertise.
Solutions experts
Our Businesses
